* Quartz and quartz wafers for wafer board
Spec: L 900mm × W 800mm × H 1600mm
Power Supply: AC 3¢
220V/380V 50Hz/60Hz
UV Power:5Kw*1
UV Lamp: Mercury Lamp or Metal Lamp
Curing Width:340mm Lamp Arc 400mm
Cooling:Air Cooling
Reflector: Cold Mirror
UV Filter: Hot Mirror
Option:N2+etc
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Feature
* This curing machine is designed to be used in the process for
fastening and unfastening wafers in the semiconductor wafer-processing CMP
process
* For semiconductor wafer-processing process
* No adhesive residues (chips) left so that adhesion after the
processing of wafers can be easily removed
* There are variable types of scan and irradiation distance, all of
which can be applied to wafers with various specifications.
* Realize the out-gas system and cleam chamber by adopting the N2
purge system
Company Website: http://www.jmuv.co.kr
Inquiry:E-mail:mmdsmv@naver.com
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